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Electrically yielding collective hybrid bonding for 3D stacking of ICs

dc.contributor.authorJourdain, Anne
dc.contributor.authorSoussan, Philippe
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-17T23:14:22Z
dc.date.available2021-10-17T23:14:22Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15551
dc.sourceIIOimport
dc.titleElectrically yielding collective hybrid bonding for 3D stacking of ICs
dc.typeProceedings paper
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage11
dc.source.endpage13
dc.source.conference59th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate26/05/2009
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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