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On the reliability of Cu contacts for the 32nm technology node and beyond

dc.contributor.authorKauerauf, Thomas
dc.contributor.authorDemuynck, Steven
dc.contributor.authorButera, Geni
dc.contributor.authorBogan, Justin
dc.contributor.authorTokei, Zsolt
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-17T23:20:45Z
dc.date.available2021-10-17T23:20:45Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15574
dc.sourceIIOimport
dc.titleOn the reliability of Cu contacts for the 32nm technology node and beyond
dc.typeProceedings paper
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorGroeseneken, Guido
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage799
dc.source.endpage800
dc.source.conferenceInternational Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate7/10/2009
dc.source.conferencelocation
imec.availabilityPublished - open access


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