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Reliability analysis of Cu contacts with various diffusion barriers

dc.contributor.authorKauerauf, Thomas
dc.contributor.authorDemuynck, Steven
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyer, Gerald
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-17T23:21:02Z
dc.date.available2021-10-17T23:21:02Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15575
dc.sourceIIOimport
dc.titleReliability analysis of Cu contacts with various diffusion barriers
dc.typeProceedings paper
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage727
dc.source.endpage731
dc.source.conferenceAdvanced Metallization Conference 2008 (AMC 2008)
dc.source.conferencedate23/09/2008
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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