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Effect of top power on low-k damage during oxygen strip in a TCP etch chamber

dc.contributor.authorKunnen, Eddy
dc.contributor.authorShamiryan, Denis
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBoullart, Werner
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-17T23:38:30Z
dc.date.available2021-10-17T23:38:30Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15633
dc.sourceIIOimport
dc.titleEffect of top power on low-k damage during oxygen strip in a TCP etch chamber
dc.typeOral presentation
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewno
dc.source.conference18th Workshop Materials for Advanced Metallization - MAM
dc.source.conferencedate8/03/2009
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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