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Articles
A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
Publication:
A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
Date
2009
Journal article
https://doi.org/10.1007/s11664-009-0841-0
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16839.pdf
1021.59 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lambrinou, Konstantza
;
Maurissen, Wout
;
Limaye, Paresh
;
Vandevelde, Bart
;
Verlinden, Bert
;
De Wolf, Ingrid
Journal
Journal of Electronic Materials
Abstract
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1912
since deposited on 2021-10-17
Acq. date: 2025-10-28
Citations
Metrics
Views
1912
since deposited on 2021-10-17
Acq. date: 2025-10-28
Citations