Show simple item record

A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints

dc.contributor.authorLambrinou, Konstantza
dc.contributor.authorMaurissen, Wout
dc.contributor.authorLimaye, Paresh
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVerlinden, Bert
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-17T23:43:25Z
dc.date.available2021-10-17T23:43:25Z
dc.date.issued2009
dc.identifier.issn0361-5235
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15650
dc.sourceIIOimport
dc.titleA novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints
dc.typeJournal article
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.identifier.doi10.1007/s11664-009-0841-0
dc.source.peerreviewyes
dc.source.beginpage1881
dc.source.endpage1895
dc.source.journalJournal of Electronic Materials
dc.source.issue9
dc.source.volume38
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
16839.pdf
Size:
1021.Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record