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Cu/Low-k thickness measurement for advanced Cu CMP process development and control

dc.contributor.authorLi, Yunlong
dc.contributor.authorHeylen, Nancy
dc.contributor.authorDelande, Tinne
dc.contributor.authorKellens, Kristof
dc.contributor.authorOng, Patrick
dc.contributor.authorLeunissen, Peter
dc.contributor.authorTarnowka, Alexandre
dc.contributor.authorEliyahu, Aviv
dc.date.accessioned2021-10-18T00:00:57Z
dc.date.available2021-10-18T00:00:57Z
dc.date.issued2009-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15711
dc.sourceIIOimport
dc.titleCu/Low-k thickness measurement for advanced Cu CMP process development and control
dc.typeProceedings paper
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorKellens, Kristof
dc.contributor.imecauthorOng, Patrick
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.source.peerreviewyes
dc.source.beginpage453
dc.source.endpage458
dc.source.conferenceInternational Semiconductor Technology Conference - ISTC/CSTIC
dc.source.conferencedate19/03/2009
dc.source.conferencelocationShanghai China
dc.identifier.urlhttp://www.ecsdl.org/getpdf/servlet/GetPDFServlet?filetype=pdf&id=ECSTF8000018000001000453000001&idtype=cvips&prog=normal
imec.availabilityPublished - imec
imec.internalnotesECS Transactions. Vol.18. Issue 1


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