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Optical metrology based post Cu CMP metal residue detection and characterization

dc.contributor.authorLi, Yunlong
dc.contributor.authorTarnowka, Alexandre
dc.contributor.authorEliyahu, Aviv
dc.contributor.authorHeylen, Nancy
dc.contributor.authorDelande, Tinne
dc.contributor.authorFavia, Paola
dc.contributor.authorBender, Hugo
dc.contributor.authorKellens, Kristof
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-18T00:01:16Z
dc.date.available2021-10-18T00:01:16Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15712
dc.sourceIIOimport
dc.titleOptical metrology based post Cu CMP metal residue detection and characterization
dc.typeProceedings paper
dc.contributor.imecauthorLi, Yunlong
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorDelande, Tinne
dc.contributor.imecauthorFavia, Paola
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorKellens, Kristof
dc.contributor.orcidimecLi, Yunlong::0000-0003-4791-4013
dc.contributor.orcidimecFavia, Paola::0000-0002-1019-3497
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization/CMP Technology - ICPT
dc.source.conferencedate19/11/2009
dc.source.conferencelocationFukuoka Japan
imec.availabilityPublished - imec


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