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Thermo-mechanical modeling of stress-induced-voiding in BEOL Cu interconnect structures

dc.contributor.authorLofrano, Melina
dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-18T00:09:11Z
dc.date.available2021-10-18T00:09:11Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15738
dc.sourceIIOimport
dc.titleThermo-mechanical modeling of stress-induced-voiding in BEOL Cu interconnect structures
dc.typeProceedings paper
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage499
dc.source.endpage504
dc.source.conferenceEuroSime - Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems Conference
dc.source.conferencedate27/04/2009
dc.source.conferencelocationDelft The Netherlands
imec.availabilityPublished - imec


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