Show simple item record

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

dc.contributor.authorLuhn, Ole
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.date.accessioned2021-10-18T00:18:21Z
dc.date.available2021-10-18T00:18:21Z
dc.date.issued2009
dc.identifier.issn0013-4686
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15768
dc.sourceIIOimport
dc.titleFilling of microvia with an aspect ratio of 5 by copper electrodeposition
dc.typeJournal article
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2504
dc.source.endpage2508
dc.source.journalElectrochimica Acta
dc.source.issue9
dc.source.volume54
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
16860.pdf
Size:
765.7Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record