Filling of microvia with an aspect ratio of 5 by copper electrodeposition

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Authors

Luhn, Ole; Van Hoof, Chris; Ruythooren, Wouter; Celis, Jean-Pierre

ISSN

0013-4686

Issue

9

Journal

Electrochimica Acta

Volume

54

Title

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

Publication type

Journal article

Embargo date

9999-12-31

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