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Filling of microvia with an aspect ratio of 5 by copper electrodeposition
Publication:
Filling of microvia with an aspect ratio of 5 by copper electrodeposition
Date
2009
Journal article
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Luhn, Ole
;
Van Hoof, Chris
;
Ruythooren, Wouter
;
Celis, Jean-Pierre
Journal
Electrochimica Acta
Abstract
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1965
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
1965
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations