Filling of microvia with an aspect ratio of 5 by copper electrodeposition

dc.contributor.author	Luhn, Ole
dc.contributor.author	Van Hoof, Chris
dc.contributor.author	Ruythooren, Wouter
dc.contributor.author	Celis, Jean-Pierre
dc.contributor.imecauthor	Van Hoof, Chris
dc.contributor.imecauthor	Ruythooren, Wouter
dc.date.accessioned	2021-10-18T00:18:21Z
dc.date.available	2021-10-18T00:18:21Z
dc.date.embargo	9999-12-31
dc.date.issued	2009
dc.identifier.issn	0013-4686
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/15768
dc.source.beginpage	2504
dc.source.endpage	2508
dc.source.issue	9
dc.source.journal	Electrochimica Acta
dc.source.volume	54
dc.title	Filling of microvia with an aspect ratio of 5 by copper electrodeposition
dc.type	Journal article
dspace.entity.type	Publication
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