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Evaluating the risks and benefits of 3-D technology

dc.contributor.authorMarchal, Pol
dc.contributor.authorVan Bavel, Mieke
dc.date.accessioned2021-10-18T00:34:54Z
dc.date.available2021-10-18T00:34:54Z
dc.date.issued2009-08
dc.identifier.issn0163-3767
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15821
dc.sourceIIOimport
dc.titleEvaluating the risks and benefits of 3-D technology
dc.typeJournal article
dc.contributor.imecauthorVan Bavel, Mieke
dc.source.peerreviewno
dc.source.journalSemiconductor International
dc.identifier.urlhttp://www.semiconductor.net/article/327156-Evaluating_the_Risks_and_Benefits_of_3_D_Technology.php
imec.availabilityPublished - imec
imec.internalnoteshttp://www.semiconductor.net/article/327156-Evaluating_the_Risks_and_Benefits_of_3_D_Technology.php


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