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Challenges and solutions for testing TSV-based 3D-SICs

dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-18T00:36:49Z
dc.date.available2021-10-18T00:36:49Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15827
dc.sourceIIOimport
dc.titleChallenges and solutions for testing TSV-based 3D-SICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.conference18th Asian Test Symposium - ATS
dc.source.conferencedate23/11/2009
dc.source.conferencelocationTaichung Taiwan
imec.availabilityPublished - imec
imec.internalnotesKeynote Speech


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