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Chip ultra-thinning and embedding technology for autonomous sensors array applications

dc.contributor.authorMuller, Philippe
dc.contributor.authorIker, Francois
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.authorCarchon, Geert
dc.contributor.authorDe Raedt, Walter
dc.date.accessioned2021-10-18T01:00:27Z
dc.date.available2021-10-18T01:00:27Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15897
dc.sourceIIOimport
dc.titleChip ultra-thinning and embedding technology for autonomous sensors array applications
dc.typeProceedings paper
dc.contributor.imecauthorMuller, Philippe
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1437
dc.source.endpage1439
dc.source.conference59th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/2009
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access


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