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Fine grain thermal modeling of 3D stacked structures

dc.contributor.authorOprins, Herman
dc.contributor.authorCupak, Miroslav
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVandevelde, Bart
dc.contributor.authorMarchal, Pol
dc.contributor.authorSrinivasan, Adi
dc.contributor.authorCheng, Edmund
dc.date.accessioned2021-10-18T01:17:43Z
dc.date.available2021-10-18T01:17:43Z
dc.date.issued2009-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15947
dc.sourceIIOimport
dc.titleFine grain thermal modeling of 3D stacked structures
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.beginpage45
dc.source.endpage49
dc.source.conference15th International Workshop on Thermal inverstigations of ICs and Systems - THERMINIC
dc.source.conferencedate7/10/2009
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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