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Cleaning and damage performance of single wafer cleaning tools using physcial removal forces

dc.contributor.authorPacco, Antoine
dc.contributor.authorHalder, Sandip
dc.contributor.authorKenis, Karine
dc.contributor.authorBearda, Twan
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-18T01:22:29Z
dc.date.available2021-10-18T01:22:29Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15959
dc.sourceIIOimport
dc.titleCleaning and damage performance of single wafer cleaning tools using physcial removal forces
dc.typeMeeting abstract
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.source.peerreviewno
dc.source.beginpage2092
dc.source.conference216th ECS Meeting
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - imec
imec.internalnotesMeeting Abstracts; Vol. MA2009-02


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