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Cleaning and damage performance of single wafer cleaning tools using physical removal forces

dc.contributor.authorPacco, Antoine
dc.contributor.authorHalder, Sandip
dc.contributor.authorKenis, Karine
dc.contributor.authorBearda, Twan
dc.contributor.authorMertens, Paul
dc.date.accessioned2021-10-18T01:22:50Z
dc.date.available2021-10-18T01:22:50Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15960
dc.sourceIIOimport
dc.titleCleaning and damage performance of single wafer cleaning tools using physical removal forces
dc.typeProceedings paper
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorMertens, Paul
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage311
dc.source.endpage317
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 25, issue 5


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