Show simple item record

Through-silicon via technology for 3D applications

dc.contributor.authorPhilipsen, Harold
dc.contributor.authorLuhn, Ole
dc.contributor.authorCivale, Yann
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-18T01:41:59Z
dc.date.available2021-10-18T01:41:59Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16016
dc.sourceIIOimport
dc.titleThrough-silicon via technology for 3D applications
dc.typeMeeting abstract
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage2175
dc.source.conference216th ECS Meeting
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - open access
imec.internalnotesMeeting Abstracts; Vol. MA 2009-02


Files in this item

Thumbnail
Name:
18403.pdf
Size:
143.7Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record