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Cu electrodeposition for Through-Silicon Via Technology

dc.contributor.authorPhilipsen, Harold
dc.contributor.authorLuhn, Ole
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorCivale, Yann
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-18T01:42:20Z
dc.date.available2021-10-18T01:42:20Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16017
dc.sourceIIOimport
dc.titleCu electrodeposition for Through-Silicon Via Technology
dc.typeMeeting abstract
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.source.peerreviewyes
dc.source.beginpage990
dc.source.conference215th Electrochemical Society Spring Meeting
dc.source.conferencedate24/05/2009
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMeeting Abstracts; Vol. MA 2009-01


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