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Improved solder joint reliability in polymer stud grid array packages by structural design optimisation

dc.contributor.authorVandevelde, Bart
dc.contributor.authorChristiaens, Filip
dc.contributor.authorBeyne, Eric
dc.contributor.authorRoggen, Jean
dc.contributor.authorVan Puymbroeck, J.
dc.contributor.authorHeerman, M.
dc.date.accessioned2021-09-29T15:43:24Z
dc.date.available2021-09-29T15:43:24Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1603
dc.sourceIIOimport
dc.titleImproved solder joint reliability in polymer stud grid array packages by structural design optimisation
dc.typeOral presentation
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceWeichlöten in Forschung und Praxis
dc.source.conferencedate19/11/1996
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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