Publication:

Copper plating for 3D interconnects

Date

2009
Meeting abstract
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18534.pdf 240.79 KB

Author(s)

Radisic, Alex  
;
Luhn, Ole
;
Vaes, Jan
;
Armini, Silvia  
;
El-Mekki, Zaid  
;
Radisic, Dunja  
;
Ruythooren, Wouter  
;
Vereecken, Philippe  

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2024 since deposited on 2021-10-18
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