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Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging
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Authors
Sabuncuoglu Tezcan, Deniz
;
Duval, Fabrice
;
Philipsen, Harold
;
Luhn, Ole
;
Soussan, Philippe
;
Swinnen, Bart
Conference
59th Electronic Components and Technology Conference - ECTC
Title
Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging
Publication type
Proceedings paper
Embargo date
9999-12-31
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