Show simple item record

A new TDDB reliability prediction methodology accounting for multiple SBD and wear out

dc.contributor.authorSahhaf, Sahar
dc.contributor.authorDegraeve, Robin
dc.contributor.authorRoussel, Philippe
dc.contributor.authorKaczer, Ben
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-18T02:33:16Z
dc.date.available2021-10-18T02:33:16Z
dc.date.issued2009
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16149
dc.sourceIIOimport
dc.titleA new TDDB reliability prediction methodology accounting for multiple SBD and wear out
dc.typeJournal article
dc.contributor.imecauthorSahhaf, Sahar
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorKaczer, Ben
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecKaczer, Ben::0000-0002-1484-4007
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1424
dc.source.endpage1432
dc.source.journalIEEE Transactions on Electron Devices
dc.source.issue7
dc.source.volume56
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
18727.pdf
Size:
652.8Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record