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Use of advanced packaging techniques for mounting and alignment of optoelectrical components

dc.contributor.authorVanwassenhove, Luc
dc.date.accessioned2021-09-29T15:46:50Z
dc.date.available2021-09-29T15:46:50Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1622
dc.sourceIIOimport
dc.titleUse of advanced packaging techniques for mounting and alignment of optoelectrical components
dc.typeOral presentation
dc.source.peerreviewno
dc.source.conferenceURSI Forum 1996; December 11, 1996; Mons, Belgium.
dc.source.conferencelocation
imec.availabilityPublished - imec


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