Show simple item record

Flip-Chip technology for low cost optical interconnections

dc.contributor.authorVanwassenhove, Luc
dc.contributor.authorHaelvoet, Kurt
dc.contributor.authorVandeputte, Koen
dc.contributor.authorVan Daele, P.
dc.contributor.authorMartens, Luc
dc.contributor.authorVandewege, Jan
dc.date.accessioned2021-09-29T15:47:12Z
dc.date.available2021-09-29T15:47:12Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1624
dc.sourceIIOimport
dc.titleFlip-Chip technology for low cost optical interconnections
dc.typeProceedings paper
dc.contributor.imecauthorMartens, Luc
dc.source.peerreviewno
dc.source.beginpage179
dc.source.endpage182
dc.source.conferenceProceedings of the Annual Symposium of the IEEE/LEOS Benelux Chapter; 28 November 1996; Enschede, The Netherlands.
dc.source.conferencelocation
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record