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Cost-effective 3D-system integration

dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-18T03:27:48Z
dc.date.available2021-10-18T03:27:48Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16283
dc.sourceIIOimport
dc.titleCost-effective 3D-system integration
dc.typeProceedings paper
dc.contributor.imecauthorSwinnen, Bart
dc.source.peerreviewno
dc.source.conferenceThin Wafer Processing for 3D TSV Applications Workshop
dc.source.conferencedate15/07/2009
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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