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Simulation of Ar/Cl2/O2 inductively coupled plasmas used for anisotropic etching of silicon

dc.contributor.authorTinck, Stefan
dc.contributor.authorBogaerts, Annemie
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-18T03:38:08Z
dc.date.available2021-10-18T03:38:08Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16310
dc.sourceIIOimport
dc.titleSimulation of Ar/Cl2/O2 inductively coupled plasmas used for anisotropic etching of silicon
dc.typeMeeting abstract
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conference2nd International Plasma Etch and Strip in Microelectronics Workshop - PESM
dc.source.conferencedate26/02/2009
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - open access


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