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Compact thermal modeling of hot spots in advanced 3D-stacked structures

dc.contributor.authorTorregiani, Cristina
dc.contributor.authorOprins, Herman
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-18T03:42:41Z
dc.date.available2021-10-18T03:42:41Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16321
dc.sourceIIOimport
dc.titleCompact thermal modeling of hot spots in advanced 3D-stacked structures
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.conference11th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate9/12/2009
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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