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Numerical and experimental analysis of stretching induced interconnect delamination

dc.contributor.authorvan der Sluis, Olaf
dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorTimmermans, P.H.M.
dc.contributor.authorGonzalez, Mario
dc.contributor.authorHoefnagels, J.P.M.
dc.date.accessioned2021-10-18T04:04:31Z
dc.date.available2021-10-18T04:04:31Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16375
dc.sourceIIOimport
dc.titleNumerical and experimental analysis of stretching induced interconnect delamination
dc.typeOral presentation
dc.contributor.imecauthorGonzalez, Mario
dc.source.peerreviewno
dc.source.conferenceFlexable & Stretchable Electronics Workshop
dc.source.conferencedate17/11/2009
dc.source.conferencelocationGent Belgium
imec.availabilityPublished - imec


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