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Wireless activity monitor using 3D integration

dc.contributor.authorVan Doremalen, Ric
dc.contributor.authorVan Engen, Piet
dc.contributor.authorJochems, Wouter
dc.contributor.authorRommers, Ad
dc.contributor.authorMaas, Geert
dc.contributor.authorCheng, Shi
dc.contributor.authorRydberg, Anders
dc.contributor.authorFritzsch, Thomas
dc.contributor.authorWolf, Jürgen
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorJansen, Roelof
dc.contributor.authorMuller, Philippe
dc.contributor.authorAlarcon, Eduardo
dc.contributor.authorSanduleanu, Mihai
dc.date.accessioned2021-10-18T04:05:57Z
dc.date.available2021-10-18T04:05:57Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16378
dc.sourceIIOimport
dc.titleWireless activity monitor using 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorJansen, Roelof
dc.contributor.imecauthorMuller, Philippe
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecJansen, Roelof::0000-0001-6685-4699
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage86
dc.source.endpage91
dc.source.conferenceDesign, Test, Integration & Packaging of MEMS/MOEMS - DTIP of MEMS & MOEMS
dc.source.conferencedate1/04/2009
dc.source.conferencelocationRome Italy
imec.availabilityPublished - open access


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