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3D Si-level integration in wireless sensor node

dc.contributor.authorvan Engen, Piet
dc.contributor.authorvan Doremalen, Ric
dc.contributor.authorJochems, Wouter
dc.contributor.authorRommers, Ad
dc.contributor.authorCheng, Shi
dc.contributor.authorRydberg, Anders
dc.contributor.authorFritzsch, Thomas
dc.contributor.authorWolf, Jürgen
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorMuller, Philippe
dc.contributor.authorAlarcon, Eduardo
dc.contributor.authorSanduleanu, Mihai
dc.date.accessioned2021-10-18T04:08:26Z
dc.date.available2021-10-18T04:08:26Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16383
dc.sourceIIOimport
dc.title3D Si-level integration in wireless sensor node
dc.typeProceedings paper
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorMuller, Philippe
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceSmart Systems Integration
dc.source.conferencedate10/03/2009
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - open access


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