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Defect-free isolation on high-thermal-conductivity SOI substrates for complementary BiCMOS technology

dc.contributor.authorVan Wichelen, Koen
dc.contributor.authorOng, Patrick
dc.contributor.authorMoussa, Alain
dc.contributor.authorRadisic, Dunja
dc.contributor.authorDevriendt, Katia
dc.contributor.authorHalder, Sandip
dc.contributor.authorKenis, Karine
dc.contributor.authorLee, Willie
dc.contributor.authorVandevelde, Bart
dc.contributor.authorSoonekindt, Christophe
dc.contributor.authorShahar, Abdul Hadi
dc.contributor.authorSmet, Tom
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorSeacrist, Mike
dc.contributor.authorRies, Mike
dc.contributor.authorDrobny, Vladimir
dc.contributor.authorWise, Rick
dc.date.accessioned2021-10-18T04:21:38Z
dc.date.available2021-10-18T04:21:38Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16415
dc.sourceIIOimport
dc.titleDefect-free isolation on high-thermal-conductivity SOI substrates for complementary BiCMOS technology
dc.typeProceedings paper
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorRadisic, Dunja
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorShahar, Abdul Hadi
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage824
dc.source.endpage825
dc.source.conferenceInternational Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate6/10/2009
dc.source.conferencelocationSENDAI JAPAN
imec.availabilityPublished - open access


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