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Low-k organic spin-on materials in a non-etchback interconnect strategy

dc.contributor.authorWaeterloos, Joost
dc.contributor.authorMeynen, Herman
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorGrillaert, Joost
dc.contributor.authorVan den hove, Luc
dc.date.accessioned2021-09-29T15:50:38Z
dc.date.available2021-09-29T15:50:38Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1643
dc.sourceIIOimport
dc.titleLow-k organic spin-on materials in a non-etchback interconnect strategy
dc.typeProceedings paper
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVan den hove, Luc
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage52
dc.source.endpage59
dc.source.conference2nd International Dielectrics for VLSI/ULSI Multilevel Interconnection Conference - DUMIC
dc.source.conferencedate20/02/1996
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - open access


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