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30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning

dc.contributor.authorVersluijs, Janko
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorGoossens, Danny
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorWiaux, Vincent
dc.contributor.authorStruyf, Herbert
dc.contributor.authorMaenhoudt, Mireille
dc.contributor.authorBrouri, Mohand
dc.contributor.authorVertommen, Johan
dc.contributor.authorKim, Ji Soo
dc.contributor.authorZhu, Helen
dc.contributor.authorSadjadi, Reza
dc.date.accessioned2021-10-18T04:56:33Z
dc.date.available2021-10-18T04:56:33Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16496
dc.sourceIIOimport
dc.title30-nm half-pitch metal patterning using MotifTM critical dimension shrink technique and double patterning
dc.typeJournal article
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorGoossens, Danny
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorWiaux, Vincent
dc.contributor.imecauthorStruyf, Herbert
dc.source.peerreviewno
dc.source.beginpage11007
dc.source.journalJournal of Micro/Nanolithography MEMS MOEMS
dc.source.issue1
dc.source.volume8
imec.availabilityPublished - imec


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