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Application of a nano-mechanical sensor to monitor stress in copper damascene interconnects

dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.authorVereecke, Bart
dc.contributor.authorBeyer, Gerald
dc.contributor.authorO'Neill, A.G.
dc.contributor.authorHorsfall, A.B.
dc.date.accessioned2021-10-18T05:18:00Z
dc.date.available2021-10-18T05:18:00Z
dc.date.issued2009
dc.identifier.issn1882-0778
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16544
dc.sourceIIOimport
dc.titleApplication of a nano-mechanical sensor to monitor stress in copper damascene interconnects
dc.typeJournal article
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVereecke, Bart
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage96503
dc.source.journalApplied Physics Express
dc.source.issue9
dc.source.volume2
imec.availabilityPublished - imec


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