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Synchrotron measurement of the effect of line-width scaling on stress in advanced Cu/Low-k interconnects

dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorZhao, Chao
dc.contributor.authorMetzger, T.H.
dc.contributor.authorZhao, Larry
dc.contributor.authorBeyer, Gerald
dc.contributor.authorHorsfall, A.B.
dc.contributor.authorO'Neill, A.G.
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-18T05:18:57Z
dc.date.available2021-10-18T05:18:57Z
dc.date.issued2009
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16546
dc.sourceIIOimport
dc.titleSynchrotron measurement of the effect of line-width scaling on stress in advanced Cu/Low-k interconnects
dc.typeJournal article
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage53524
dc.source.journalJournal of Applied Physics
dc.source.issue5
dc.source.volume106
imec.availabilityPublished - imec


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