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Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction

dc.contributor.authorWilson, Chris
dc.contributor.authorZhao, Chao
dc.contributor.authorZhao, Larry
dc.contributor.authorMetzger, T.H.
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.authorPantouvaki, Marianna
dc.contributor.authorBeyer, Gerald
dc.contributor.authorHorsfall, A.B.
dc.contributor.authorO Neill, A.G.
dc.date.accessioned2021-10-18T05:20:22Z
dc.date.available2021-10-18T05:20:22Z
dc.date.issued2009
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16549
dc.sourceIIOimport
dc.titleStudy of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction
dc.typeJournal article
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorPantouvaki, Marianna
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage181914
dc.source.journalApplied Physics Letters
dc.source.issue18
dc.source.volume94
imec.availabilityPublished - imec


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