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The effect of the passivation material on the stress and stress relaxation behaviour of narrow Al-Si-Cu lines

dc.contributor.authorWitvrouw, Ann
dc.contributor.authorFlinn, P. A.
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-09-29T15:53:43Z
dc.date.available2021-09-29T15:53:43Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1660
dc.sourceIIOimport
dc.titleThe effect of the passivation material on the stress and stress relaxation behaviour of narrow Al-Si-Cu lines
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage519
dc.source.endpage524
dc.source.conferenceMaterials Reliability in Microelectronics VI
dc.source.conferencedate8/04/1996
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Symposium Proceedings; Vol. 428


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