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Cu/Sn microbumps interconnect for 3D TSV chip stacking

dc.contributor.authorAgarwal, Rahul
dc.contributor.authorZhang, Wenqi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorLabie, Riet
dc.contributor.authorDimcic, Biljana
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-18T15:15:10Z
dc.date.available2021-10-18T15:15:10Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16632
dc.sourceIIOimport
dc.titleCu/Sn microbumps interconnect for 3D TSV chip stacking
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewno
dc.source.beginpage858
dc.source.endpage863
dc.source.conferenceIEEE 60th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate1/06/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - imec


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