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Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers

dc.contributor.authorArmini, Silvia
dc.contributor.authorMaestre Caro, Arantxa
dc.date.accessioned2021-10-18T15:16:01Z
dc.date.available2021-10-18T15:16:01Z
dc.date.issued2010
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16663
dc.sourceIIOimport
dc.titleMaterials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers
dc.typeJournal article
dc.contributor.imecauthorArmini, Silvia
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.source.peerreviewyes
dc.source.beginpageD74
dc.source.endpageD80
dc.source.journalJournal of the Electrochemical Society
dc.source.issue1
dc.source.volume157
imec.availabilityPublished - imec


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