Materials engineering for future interconnects: catalyst-free  electroless Cu deposition on self-assembled monolayer alternative barriers

Publication:

2010

Journal article

Author(s)

;

Maestre Caro, Arantxa

Journal of the Electrochemical Society

1884 since deposited on 2021-10-18

2last month

1last week

Acq. date: 2026-09-19