Publication:
Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers
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1878 since deposited on 2021-10-18
1last month
Acq. date: 2025-12-15
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Metrics
Views
1878 since deposited on 2021-10-18
1last month
Acq. date: 2025-12-15
Citations