Publication:
Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers
Date
| dc.contributor.author | Armini, Silvia | |
| dc.contributor.author | Maestre Caro, Arantxa | |
| dc.contributor.imecauthor | Armini, Silvia | |
| dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
| dc.date.accessioned | 2021-10-18T15:16:01Z | |
| dc.date.available | 2021-10-18T15:16:01Z | |
| dc.date.issued | 2010 | |
| dc.identifier.issn | 0013-4651 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16663 | |
| dc.source.beginpage | D74 | |
| dc.source.endpage | D80 | |
| dc.source.issue | 1 | |
| dc.source.journal | Journal of the Electrochemical Society | |
| dc.source.volume | 157 | |
| dc.title | Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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