dc.contributor.author | Armini, Silvia | |
dc.contributor.author | Philipsen, Harold | |
dc.contributor.author | El-Mekki, Zaid | |
dc.contributor.author | Redolfi, Augusto | |
dc.contributor.author | Van Ammel, Annemie | |
dc.contributor.author | Radisic, Alex | |
dc.contributor.author | Nagar, Magi | |
dc.contributor.author | Ruythooren, Wouter | |
dc.date.accessioned | 2021-10-18T15:16:04Z | |
dc.date.available | 2021-10-18T15:16:04Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16664 | |
dc.source | IIOimport | |
dc.title | Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVs | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Armini, Silvia | |
dc.contributor.imecauthor | Philipsen, Harold | |
dc.contributor.imecauthor | El-Mekki, Zaid | |
dc.contributor.imecauthor | Redolfi, Augusto | |
dc.contributor.imecauthor | Van Ammel, Annemie | |
dc.contributor.imecauthor | Radisic, Alex | |
dc.contributor.imecauthor | Ruythooren, Wouter | |
dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
dc.contributor.orcidimec | Philipsen, Harold::0000-0002-5029-1104 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 1280 | |
dc.source.conference | 217th ECS Meeting Symposium 'Electrochemical Engineering for the 21st Century ' | |
dc.source.conferencedate | 24/04/2010 | |
dc.source.conferencelocation | Vancouver Canada | |
imec.availability | Published - open access | |
imec.internalnotes | Meeting Abstracts; Vol. MA2010-01 | |