dc.contributor.author | Armini, Silvia | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Volders, Henny | |
dc.contributor.author | El-Mekki, Zaid | |
dc.contributor.author | Radisic, Alex | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Ruythooren, Wouter | |
dc.contributor.author | Vereecken, Philippe | |
dc.date.accessioned | 2021-10-18T15:16:08Z | |
dc.date.available | 2021-10-18T15:16:08Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16666 | |
dc.source | IIOimport | |
dc.title | "Terminal effect" on Cu electrochemical deposition: options and roadmap | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Armini, Silvia | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Volders, Henny | |
dc.contributor.imecauthor | El-Mekki, Zaid | |
dc.contributor.imecauthor | Radisic, Alex | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Ruythooren, Wouter | |
dc.contributor.imecauthor | Vereecken, Philippe | |
dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
dc.contributor.orcidimec | Vereecken, Philippe::0000-0003-4115-0075 | |
dc.contributor.orcidimec | El-Mekki, Zaid::0000-0002-9851-9139 | |
dc.source.peerreview | no | |
dc.source.conference | Materials for Advanced Metallization Conference - MAM | |
dc.source.conferencedate | 8/03/2010 | |
dc.source.conferencelocation | Mechelen Belgium | |
imec.availability | Published - imec | |