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Impact of "Terminal Effect" on Cu plating: theory and experimental evidence

dc.contributor.authorArmini, Silvia
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-18T15:16:10Z
dc.date.available2021-10-18T15:16:10Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16667
dc.sourceIIOimport
dc.titleImpact of "Terminal Effect" on Cu plating: theory and experimental evidence
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage185
dc.source.endpage194
dc.source.conferenceSemiconductors, Metal Oxides, and Composites: Metallization and Electrodeposition of Thin Films and Nanostructures
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 25, Issue 27


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