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Improved thermal dissipation in InP wire photonic crystal laser on silicon by addition of diamond nanoparticles in polymer bonding layer

dc.contributor.authorBazin, A.
dc.contributor.authorHalioua, Y.
dc.contributor.authorMonnier, P.
dc.contributor.authorBordas, F.
dc.contributor.authorKarle, T.J.
dc.contributor.authorPerruchas, S.
dc.contributor.authorGacoin, T.
dc.contributor.authorGirard, H.
dc.contributor.authorSagnes, I.
dc.contributor.authorRaj, R.
dc.contributor.authorRaineri, F.
dc.date.accessioned2021-10-18T15:18:54Z
dc.date.available2021-10-18T15:18:54Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16718
dc.sourceIIOimport
dc.titleImproved thermal dissipation in InP wire photonic crystal laser on silicon by addition of diamond nanoparticles in polymer bonding layer
dc.typeProceedings paper
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceEOS Annual Meeting - EOSAM
dc.source.conferencedate26/10/2010
dc.source.conferencelocationParis France
imec.availabilityPublished - open access


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