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3D system integration - opportunities and challenges

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T15:20:58Z
dc.date.available2021-10-18T15:20:58Z
dc.date.issued2010-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16744
dc.sourceIIOimport
dc.title3D system integration - opportunities and challenges
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference7th International 3-D Architectures for Semiconductor Integration and Packaging Conference and Exhibition
dc.source.conferencedate8/12/2010
dc.source.conferencelocationBurlingame, CA USA
imec.availabilityPublished - imec


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